REVAMP: challenges and innovation roadmap for variability management in round-trip engineering of software-intensive systems - Université Paris 1 Panthéon-Sorbonne Access content directly
Journal Articles Génie logiciel : le magazine de l'ingénierie du logiciel et des systèmes Year : 2017

REVAMP: challenges and innovation roadmap for variability management in round-trip engineering of software-intensive systems

Andrey Sadovykh
Alessandra Bagnato
  • Function : Author
Alexander Viehl
  • Function : Author
  • PersonId : 1064271
Jabier Martinez

Abstract

The Software Intensive Systems (SIS) has become dominant in industry. The Product Lines (PL) approach offers significant cost reductions in customisation and rapid development of products targeting various market segments. However, Product Lines Engineering often times requires a complex modelling and co-evolution of multiple assets. That hinders the proliferation of the PL approach and constraints its accessibility for SMEs and larger community of system developers. The ITEA 3 project REVaMP² aims to conceive, develop and evaluate the first comprehensive automation tool-chain and associated executable process to support round-trip engineering of SIS Product Lines and thereby helping to profitably engineer mass customised products and services.
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Dates and versions

hal-03968410 , version 1 (01-02-2023)

Identifiers

  • HAL Id : hal-03968410 , version 1

Cite

Andrey Sadovykh, Alessandra Bagnato, Jacques Robin, Alexander Viehl, Tewfik Ziadi, et al.. REVAMP: challenges and innovation roadmap for variability management in round-trip engineering of software-intensive systems. Génie logiciel : le magazine de l'ingénierie du logiciel et des systèmes, In press, 120, pp.32-36. ⟨hal-03968410⟩
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